EN
Features
-Space-saving DIP structure for easy PCB integration in compact electronic equipment
-Reliable switching performance with fast response for accurate signal control
-Low coil power consumption and stable contact resistance for efficient circuit operation
-Durable construction and consistent electrical performance for telecommunications, instrumentation, and automation applications
Applications
1.Consumer Electronics
2.Security and Alarm Systems
3.Computer and Peripheral Devices
4.Instrumentation and Monitoring Systems
Specifications
● 2 Form C configuration
● High switching capacity: 125VA/60W
● Matching 16 pin IC socket
● Bifurcated contacts
● Epoxy sealed for automatic-wave soldering and cleaning
Technical Documents
Please contact us for more information.
SUBMINIATURE DIP RELAY : HFD27
