EN
Features
-Compact DIP package design for space-saving PCB mounting and high-density electronic applications
-High sensitivity and low power consumption for efficient and reliable signal switching
-Stable contact performance and excellent electrical insulation for dependable circuit operation
-Easy through-hole installation with long service life, suitable for communication and industrial control systems
Applications
1.Telecommunications Equipment
2.Industrial Automation Systems
3.Electronic Control Systems
4.Test and Measurement Instruments
Specifications
● High sensitive: 150mW
● Matching standard16 pin IC socket
● High switching capacity: 125VA / 90W
● Bifurcated contacts
● Epoxy sealed for automatic wave soldering and cleaning
● Single side stable and latching type available
Technical Documents
Please contact us for more information.
SUBMINIATURE DIP RELAY : HFD2
